Learn about the 4 most common types of microfabrication techniques, including lithography, deposition, etching, and bonding, and their applications.
4 Most Common Types of Microfabrication Techniques
Microfabrication is a set of processes used to create microscale structures, devices, and systems with small dimensions, usually on the order of micrometers. Microfabrication techniques are used in a wide range of applications, including electronics, photonics, and biotechnology. In this article, we will discuss the four most common types of microfabrication techniques.
Lithography
Lithography is a technique used to transfer patterns from a mask or a template onto a substrate. The mask contains the pattern that is to be transferred, and the substrate is the material on which the pattern is transferred. The process of lithography involves a series of steps, including photoresist coating, exposure, development, and etching. In photoresist coating, a thin layer of photoresist material is applied to the substrate. The mask is then placed on top of the photoresist, and the substrate is exposed to a source of light. The photoresist material is then developed, which removes the unexposed parts of the photoresist, leaving behind a pattern that can be transferred to the substrate using etching.
Deposition
Deposition is a technique used to deposit a thin layer of material onto a substrate. There are several types of deposition techniques, including physical vapor deposition (PVD), chemical vapor deposition (CVD), and electroplating. In PVD, a material is evaporated in a vacuum and deposited onto a substrate. In CVD, a material is deposited onto a substrate by a chemical reaction. In electroplating, a material is deposited onto a substrate by passing an electric current through a solution containing the material.
Etching
Etching is a technique used to remove material from a substrate. There are two main types of etching techniques: wet etching and dry etching. Wet etching involves using a chemical solution to remove material from the substrate. Dry etching involves using a plasma to remove material from the substrate. Dry etching is typically more precise than wet etching.
